At the ISCAS 2026 conference in Shanghai, Huawei revealed a new Kirin chip featuring logic folding technology, set to launch in its Mate 90 series in September, marking a significant leap in chipset design and competition with Apple’s upcoming iPhone 18 lineup.
- New Kirin chip introduces logic folding dual-layer design
- Chipset expected in Huawei Mate 90 series launching this autumn
- Advances could rival Apple’s iPhone 18 series performance
What happened
During the 2026 International Symposium on Circuits and Systems (ISCAS) in Shanghai, He Tingbo, a Huawei board member and head of the semiconductor business, announced the company’s plan to launch a new Kirin smartphone chip this autumn. This chip will be the first to incorporate logic folding technology, moving beyond the conventional single-layer chip layouts by stacking logic structures in a dual-layer configuration.
The new chip is expected to debut in Huawei’s Mate 90 series smartphones, scheduled for release in September 2026. This advanced design aims to improve transistor density and energy efficiency, positioning Huawei to compete more directly with Apple’s forthcoming iPhone 18 series.
Why it matters
The introduction of logic folding technology signifies a substantial innovation in semiconductor design. By stacking logic layers instead of spreading them on a single plane, the chip can achieve greater performance and power efficiency metrics, which are crucial for powering next-generation smartphones and AI applications.
Furthermore, Huawei unveiled the Tau (τ) Scaling Law, also known as 'Her’s Law', named after He Tingbo, which outlines the trajectory for increasing transistor density in high-end chips. According to Huawei, by 2031, chips designed under this principle could reach transistor scales comparable to 14 Å (1.4 nm) process technology, setting a roadmap for advanced semiconductor development.
What to watch next
Observers should closely monitor the official launch of the Huawei Mate 90 series this autumn to evaluate the real-world impact of logic folding technology on device performance and battery life. This release will also offer insights into Huawei’s competitive stance against Apple’s iPhone 18 series in the premium smartphone market.
Additionally, developments around the practical implementation and adoption of the Tau (τ) Scaling Law in Huawei’s chip design will be critical. Tracking Huawei’s semiconductor progress could reveal broader trends in China’s ambition to innovate independently in high-end chipmaking amid global technology tensions.