Singapore-based Nexstrom is developing equipment to enable large-scale manufacturing of two-dimensional semiconductor materials directly on wafers, addressing challenges that silicon transistor scaling faces.
- Nexstrom targets scalable production of 2D semiconductors on 300mm wafers
- Raised $12 million in recent seed funding to advance technology
- Plans commercial readiness between 2030 and 2035
What happened
Nexstrom, a Singapore-based semiconductor startup incubated by Xora Innovation, has raised $12 million in a seed round to further develop its equipment capable of growing ultra-thin transition-metal dichalcogenides (TMDs) directly on 300mm semiconductor wafers. This funding adds to a total of $15 million raised so far and will be utilized to improve process control, scale production capabilities, and support qualification programs with potential industry partners.
The company, led by CEO Phoebe Tan and cofounded by scientist Lance Li, aims to bridge the gap between laboratory-scale production of 2D materials and the demands of commercial semiconductor manufacturing. Nexstrom has demonstrated material quality on wafers using its newly installed 12-inch system and is progressing through intermediate wafer sizes before targeting full-scale production capabilities.
Why it matters
As silicon transistor sizes shrink, controlling electron flow becomes increasingly difficult, leading to challenges such as leakage, power loss, and heat generation. Two-dimensional materials like TMDs, which are just a few atomic layers thick, hold promise to continue performance advancements where silicon scaling hits physical limits. Successfully integrating these materials at commercial scale could significantly impact the semiconductor industry’s trajectory.
Major players including TSMC, Intel, and IMEC are actively researching 2D semiconductor integration, but consistent, scalable production remains a technological hurdle. Nexstrom’s innovation addresses this critical bottleneck by aiming to manufacture these materials directly on standard-sized wafers used in leading fabs. This could enable chipmakers to adopt new semiconductor materials without drastic changes to existing processes.
What to watch next
In the coming years, Nexstrom will focus on advancing from small-scale lab demonstrations to industrial-scale manufacturing. Completing the scale-up to 8-inch wafers by October and preparing for eventual 12-inch wafer production are key milestones. The company’s timeline anticipates having commercial-ready equipment between 2030 and 2035, reflecting the complexity of integrating new materials into mature semiconductor fabrication ecosystems.
Potential partnerships or licensing agreements with major semiconductor manufacturers will be critical to Nexstrom’s success. While the startup has disclosed that some industry players are testing its samples, revealing collaborators and securing formal engagements could further validate its technology. Additionally, ongoing improvements in process control and measurement will be essential to meet the stringent quality requirements of the semiconductor industry.